The advanced packaging technology team of Zhongke Tongde SiP has rich experience in chip packaging and is committed to developing highly integrated packaging solutions to meet the needs of customers for miniaturized and high-performance electronic products. Our SiP technology can be applied in various fields, including satellite communication, automotive electronics, consumer electronics, medical devices, the Internet of Things, and aerospace.
The company is committed to continuously promoting innovation in chip packaging technology to break free from the current bottleneck in the domestic chip industry. Develop smaller, higher performance, and more energy-efficient packaging solutions to meet the constantly evolving market demands
The company expands its product and service portfolio to provide more diverse packaging solutions to meet the needs of different industries and applications. Including the application of new materials, multi-layer packaging, 3D packaging, etc.
