Zhongke Tongde Microelectronics Technology (Datong) Co., Ltd. is an innovative SIP advanced packaging solution (new design, new process, new equipment, new materials) and business model, using ceramics or glass as the substrate to achieve 3D packaging, replacing the current etching process with dry process, reducing investment and total production costs in the chip packaging field, shortening product launch time, and achieving lean production, To provide advanced packaging core technology and production delivery capabilities for China's semiconductor industry, and gradually develop into an innovative enterprise with the world's most leading and cutting-edge chip packaging core technology, breaking through the traditional vertical semiconductor industry chain, providing overall solutions, fully mobilizing and integrating substrate, materials, chip design, systems, Foundry, storage and other manufacturers for cross collaboration, To jointly achieve the upgrading and catching up of China's semiconductor industry.
Zhongke Tongde focuses on the research and application of SiP packaging technology. The total investment of SiP Advanced Packaging Phase I project under its umbrella is 5 billion yuan.
The mission of Zhongke Tongde Microelectronics Technology (Datong) Co., Ltd. is to lead the development of SiP packaging technology, provide customers with smaller, higher performance, and more energy-efficient electronic solutions, and help them stand out in fierce market competition. We are committed to becoming a trusted innovation partner to help customers achieve their technological vision and business goals.
The company is committed to continuously promoting innovation in chip packaging technology to break free from the current bottleneck in the domestic chip industry. Develop smaller, higher performance, and more energy-efficient packaging solutions to meet the constantly evolving market demands.
Zhongke Tongde focuses on the research and application of SiP packaging technology. The total investment of SiP Advanced Packaging Phase I project under its umbrella is 5 billion yuan.
On February 27th, the company strengthened cooperation with other chip packaging companies, semiconductor manufacturers, and research institutions to jointly address industry challenges and accelerate the process of technological innovation.
On March 28th, the company established industry university cooperation with multiple universities to cultivate semiconductor professionals and invest in employee training and education
Zhongke Tongde focuses on the research and application of SiP packaging technology. The total investment of SiP Advanced Packaging Phase I project under its umbrella is 5 billion yuan.
On February 27th, the company strengthened cooperation with other chip packaging companies, semiconductor manufacturers, and research institutions to jointly address industry challenges and accelerate the process of technological innovation.
On March 28th, the company established industry university cooperation with multiple universities to cultivate semiconductor professionals and invest in employee training and education
Zhongke Tongde focuses on the research and application of SiP packaging technology. The total investment of SiP Advanced Packaging Phase I project under its umbrella is 5 billion yuan.
On February 27th, the company strengthened cooperation with other chip packaging companies, semiconductor manufacturers, and research institutions to jointly address industry challenges and accelerate the process of technological innovation.
On March 28th, the company established industry university cooperation with multiple universities to cultivate semiconductor professionals and invest in employee training and education
Zhongke Tongde focuses on the research and application of SiP packaging technology. The total investment of SiP Advanced Packaging Phase I project under its umbrella is 5 billion yuan.
On February 27th, the company strengthened cooperation with other chip packaging companies, semiconductor manufacturers, and research institutions to jointly address industry challenges and accelerate the process of technological innovation.
On March 28th, the company established industry university cooperation with multiple universities to cultivate semiconductor professionals and invest in employee training and education
Zhongke Tongde focuses on the research and application of SiP packaging technology. The total investment of SiP Advanced Packaging Phase I project under its umbrella is 5 billion yuan.
On February 27th, the company strengthened cooperation with other chip packaging companies, semiconductor manufacturers, and research institutions to jointly address industry challenges and accelerate the process of technological innovation.
On March 28th, the company established industry university cooperation with multiple universities to cultivate semiconductor professionals and invest in employee training and education
