Zhongke Tongde provides the following products and services

Zhongke Tongde Microelectronics Technology (Datong) Co., Ltd. is an innovative SIP advanced packaging solution (new design, new process, new equipment, new materials) and business model, using ceramics or glass as the substrate to achieve 3D packaging, replacing the current etching process with dry process, reducing investment and total production costs in the chip packaging field, shortening product launch time, and achieving lean production, To provide advanced packaging core technology and production delivery capabilities for China's semiconductor industry, and gradually develop into an innovative enterprise with the world's most leading and cutting-edge chip packaging core technology, breaking through the traditional vertical semiconductor industry chain, providing overall solutions, fully mobilizing and integrating substrate, materials, chip design, systems, Foundry, storage and other manufacturers for cross collaboration, To jointly achieve the upgrading and catching up of China's semiconductor industry.