Focusing on advanced packaging technology and vigorously expanding the scale of industrial development, the 2023 IC Packaging Fair Semiconductor Packaging Technology Exhibition will kick off grandly at the Shenzhen International Convention and Exhibition Center (Bao'an) on October 11-13, 2023. This exhibition will bring together top semiconductor manufacturing technology experts, industry leaders, and innovators from around the world, focusing on packaging and testing factories, wafer factories, and IC design. Through IC Packaging+PCBA, we will adopt the form of "demonstration display+conference+technology and trade exchange" to jointly explore and showcase the latest technologies and solutions, helping enterprises efficiently and strongly expand their target customers in the semiconductor packaging and testing industry in South China, Boost the technological innovation and integration of China's packaging and testing industry, and ignite a new engine for the full chain development of the industry.
Looking forward to an unprecedented event with a super large scale and numerous highlights
The scale of the 2023 IC Packaging Fair semiconductor packaging technology exhibition continues to upgrade, with an exhibition area of approximately 160000+, 3000+exhibitors and industry brands, 120000+domestic visitors, and 4500+overseas visitors, creating an industry grand event with large exhibition planning, strong exhibitor lineup, and a large number of exhibition visitors. There are over 100 semiconductor packaging and testing enterprises in South China, over 50 wafer factories and well-known IC design enterprises, as well as tens of thousands of packaging and testing factories, IC design, and OBM in South China ODM and EMS electronic manufacturers gather together to connect the upstream and downstream links of the Asian semiconductor industry, link business opportunities, unleash energy, unlock potential, and create value.
At that time, the world's top wafer manufacturing and advanced packaging, as well as high-end electronic manufacturing technology events, special exhibition areas for packaging and testing factories, SiP and advanced packaging production demonstration lines, semiconductor manufacturing technology conferences, and other exhibition highlights will also be announced one by one. Over 10000 wafer factories, packaging and testing factories, IC design, OBM, ODM, and top EMS electronic manufacturers in South China, EMS factories, 3C, automotive electronics, medical electronics, Internet of Things, communication systems, AI, will also be announced Terminal enterprises such as intelligent wearables, semiconductor software, equipment and materials enterprises, and other related industry groups will expand their high-end network, obtain advanced solutions, and grasp the key to industry development in this grand event.
Solving Industry Technical Difficulties and Upgrading Advanced Wafers Again
The prosperity of IC design and the increase in capital and technological density of advanced processes have made wafers play an increasingly important role in the semiconductor industry chain. The Advanced Wafer Manufacturing Sub Forum at the 2023 IC Packaging Fair Semiconductor Packaging Technology Exhibition invites researchers from leading companies in the industry to deliver a brilliant speech on advanced wafer manufacturing, leading exhibition visitors to explore new trends in the semiconductor advanced manufacturing industry and gain insights into wafer manufacturing technology in the automotive grade chip industry chain Master the new opportunities for automotive semiconductor wafer foundry/silicon wafer manufacturing, as well as advanced wafer manufacturing solutions in the semiconductor industry and automotive industry, to continuously empower the further development and full upgrading of China's advanced wafer technology. At that time, wafer fabs such as SMIC, Huahong Group, Changjiang Storage, Wuhan Xinxin, Hefei Changxin, Jinghe Integration, Guangzhou Yuexin, Ziguang Group, China Resources Microelectronics, Silan Micro, Shenzhen Fangzheng, Guangzhou Nanke, Sanan Integration, Shenzhen Shenai, etc. will also strongly watch the exhibition, helping China's circuit industry structure transform from "small design small manufacturing large packaging testing" to "large design medium manufacturing medium packaging testing", The industrial chain extends from the low-end to the high-end.
